Package Body Material: |
PLASTIC/EPOXY |
Schmitt Trigger: |
YES |
Maximum Time At Peak Reflow Temperature (s): |
30 |
Maximum Seated Height: |
1.1 mm |
No. of Inputs: |
1 |
Minimum Supply Voltage (Vsup): |
1.65 V |
Sub-Category: |
Gates |
Surface Mount: |
YES |
Terminal Finish: |
MATTE TIN |
No. of Terminals: |
6 |
Maximum I (ol): |
24 Amp |
Terminal Position: |
DUAL |
Package Style (Meter): |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Technology: |
CMOS |
JESD-30 Code: |
R-PDSO-G6 |
Package Shape: |
RECTANGULAR |
Terminal Form: |
GULL WING |
Maximum Operating Temperature: |
85 Cel |
Package Code: |
TSSOP |
Propagation Delay At Nominal Supply: |
7.3 ns |
Width: |
1.25 mm |
Moisture Sensitivity Level (MSL): |
1 |
Packing Method: |
TR |
Load Capacitance (CL): |
50 pF |
Logic IC Type: |
BUFFER |
JESD-609 Code: |
e3 |
Minimum Operating Temperature: |
-40 Cel |
No. of Functions: |
2 |
Qualification: |
Not Qualified |
Package Equivalence Code: |
TSSOP6,.08 |
Length: |
2 mm |
Propagation Delay (tpd): |
15.8 ns |
Nominal Supply Voltage / Vsup (V): |
1.8 |
Family: |
LVC/LCX/Z |
Peak Reflow Temperature (C): |
260 |
Terminal Pitch: |
.65 mm |
Temperature Grade: |
INDUSTRIAL |
Maximum Supply Voltage (Vsup): |
5.5 V |
Power Supplies (V): |
3.3 |