NXP Semiconductors NE555D

NE555D by NXP Semiconductors
Lifecycle Status
Discontinued
Manufacturer
NXP Semiconductors
Datasheet
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Description
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Width (mm): 3.9 mm
Maximum Seated Height: 1.68 mm
Minimum Supply Voltage (Vsup): 4.5 V
Sub-Category: Analog Waveform Generation Functions
Surface Mount: YES
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, LOW PROFILE
Technology: BIPOLAR
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: LSOP
Nominal Supply Voltage (Vsup): 5 V
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SOP8,.25
Other IC type: SQUARE
Length: 4.9 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 16 V
Power Supplies (V): 5/15
ECCN EAR99
ECCN Governance EAR
HTS 8542.39.00.01
SB 8542.39.00.00
NSN 5962-01-411-7630, 5962014117630, 5962-01-484-2742, 5962014842742
NIIN 014117630, 014842742