STMicroelectronics STM32H753IIK6

STM32H753IIK6 by STMicroelectronics
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Active
Manufacturer
STMicroelectronics
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Description
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 176; Package Code: VFBGA; Package Shape: SQUARE;

Unlock the power of innovation with the STM32H753IIK6 by STMicroelectronics. This cutting-edge microcontroller offers unrivaled quality and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications, this product boasts advanced features such as multiple ADC and DAC channels, extensive connectivity options, and an impressive clock frequency. Experience the benefits of increased efficiency, performance, and flexibility with the STM32H753IIK6, setting you apart from the competition and delivering exceptional value to your projects.

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage sources.

Bit Size: 32

Provides high computational power and advanced processing capabilities for complex tasks.

DAC Channels: YES

Enables the generation of analog signals, important for various control and communication applications.

No. of Terminals: 176

Offers ample connectivity options for interfacing with other components and peripherals.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in harsh environments with low temperatures.

ADC Channels: YES

Allows for the conversion of analog signals to digital data, a critical function in data acquisition and processing.

ROM Words: 2097152

Provides large storage capacity for storing program instructions and data, enhancing the device's functionality.

Maximum Clock Frequency: 48 MHz

Delivers high-speed processing capabilities for real-time applications and rapid data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for efficient operation and optimized performance.

Minimum Supply Voltage: 1.62 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: .6 mm
Surface Mount: YES
Terminal Finish: TIN SILVER
ADC Channels: YES
No. of Terminals: 176
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
No. of I/O Lines: 140
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B176
Maximum Clock Frequency: 48 MHz
Package Shape: SQUARE
ROM Words: 2097152
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 10 mm
Moisture Sensitivity Level (MSL): 3
Data EEPROM Size: 0
Speed: 400 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 1085440
External Data Bus Width: 0
Peripherals: BOR, COMPARATOR(2), DMA(4), JPEG, LCD, POR, PWM(2), RTC, TIMER(21), WDT(2)
Bit Size: 32
DAC Channels: YES
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Digital To Analog Convertors: 2-Ch 12-Bit
Length: 10 mm
PWM Channels: YES
On Chip Program ROM Width: 8
Additional Features: UFBGA176+25 - 201-BALL; CONNECTIVITY: HDMI, SPDIFRX(4), SWPMI, MDIO
Connectivity: CAN(2), DCMI, ETHERNET, I2C(4), I2S(3), SAI(4), SDMMC(2), SPI(7), UART(5), USART(4), USB(2)
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Analog To Digital Convertors: 20-Ch 16-Bit
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
ECCN 5A992.C
ECCN Governance EAR
HTS 8542.31.00.01
SB 8542.31.00.00